With more than forty years of expertise in high-reliability hybrid and RF technologies, NEOTech has established itself as the largest provider of microelectronics assembly services in North America.
We offer a comprehensive array of services encompassing the design, development, and manufacturing of microelectronic assemblies, specializing in microwave electronics and circuits. Our dedicated teams are committed to delivering technical support and advanced testing for microelectronic assemblies, ensuring superior quality and reliability for our customers.
Access NEOTech’s Microelectronics design guides for detailed specifications to maximize your design and keep your product competitive.
These design guides are useful for:
- Starting a new design
- Support current design
- Learn more about NEOTech Microelectronics Capabilities
This package contains the following guides:
- Die Attach Design Guide
- Microcircuit Thermal Considerations
- Ribbon Bond vs Wire Bond Guide
- Aluminum Nitrade Design Guides
- Cofired Laminated Ceramic Technology Design Guides
- ECP Thick Film Systems Reference Guide
- LTCC Design Guides
- Thick Film Design Guidelines